Title :
Statistical Analysis of IMC Count Variant with Difference Soldering Reflow Profiles and Solder Ball Size
Author :
Shenq, Wong Wing
Author_Institution :
STMicroelectron. Sdn. Bhd., Johor
Abstract :
Full conversion to lead-free solder ball alloy for BGA packages is highly demanded since July 2006. Since 2005, there is concern of the lead-free solder ball interconnection weakness in mobile devices application. This study is to understand the interaction between different soldering reflow profiles and solder ball size by statistical analysis. Result shows insufficient evidence to conclude that there is interaction effect between type of Reflow Profile and type of Solder Ball Size on IMC count at 1% significant level. However, type of Reflow Profile has sufficient evidence to conclude that mean of IMC count differ significantly. Lower reflow profile temperature also has less IMC count.
Keywords :
alloys; ball grid arrays; reflow soldering; statistical analysis; IMC count variant; difference soldering reflow profiles; lead-free solder ball alloy; solder ball size; statistical analysis; Chemical elements; Consumer electronics; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Packaging machines; Soldering; Statistical analysis; Temperature; Testing;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456462