Title :
Device Under Test (DUT) Socket Conversion to Improve Analog Loadboard Performance Efficiency
Author :
Yabut, Yolando G. ; Galauran, Francis F. ; Dator, Mario C. ; Encarnado, Jezrel D.
Author_Institution :
ON Semicond. Philippines Inc., Carmona
Abstract :
This paper discusses modification on DUT socket hitting other problems ranging from over rejection, set-up loss to test escape through the incorporation of interlock switch that virtually foolproof the docking interlock mechanism. Design of experiment and actual simulation validate the effect and desire result. With this systematic approaches Analog loadboard performance brought significant improvement in productivity extending loadboard life cycle by eliminating severe PCB (printed circuit board) traces cause by repeated replacements of Pogo pins, eliminate monthly consumption of US$4K , set-up time improvement from 1 minute to 3 seconds and significant improvement in reducing the 46% open connection opportunity.
Keywords :
electric connectors; printed circuit testing; printed circuits; analog loadboard performance efficiency; device under test socket conversion; docking interlock mechanism; interlock switch; loadboard life cycle; Costs; Electric breakdown; Electronic equipment testing; Performance loss; Pins; Pulp manufacturing; Semiconductor device manufacture; Semiconductor device testing; Sockets; Switches;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456500