Title :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004 (IEEE Cat. No.04EX831)
Abstract :
The following topics are dealt with: industrial trends; technology developments; virtual thermal mechanical prototyping; thermal mechanical behavior at wafer level; dynamic compact thermal and electro-thermal models; experimental and numerical interaction; modeling and designing of advanced packaging; thermal behavior modeling and characterization; advanced numerical simulation methodologies; small scale thermal and fluid aspects in microsystems; modeling in micro technology; designing for reliability; material characterization and modeling; modeling of MEMS and optical devices; simulation-based thermal design strategies; solder reliability behavior; CFD and FE modeling of thermal performance; micro- to macro-scale thermal design challenges in microelectronics solder fatigue; characterization and modeling of polymer behavior; new developments in microelectronics reliability.
Keywords :
circuit simulation; computational fluid dynamics; fatigue; finite element analysis; heat transfer; integrated circuit design; integrated circuit modelling; integrated circuit packaging; micromechanical devices; moulding; plastic packaging; polymers; reliability; semiconductor device measurement; semiconductor device models; soldering; solders; thermal analysis; thermal management (packaging); thermal stresses; FE modeling; MEMS modeling; advanced packaging; dynamic compact electro-thermal models; macro-scale thermal design; mechanical simulation; micro technology modeling; microelectronics; microelectronics reliability; microsystem fluid aspects; microsystem small scale thermal aspects; microsystems; numerical simulation methodologies; optical devices; polymer behaviour modeling; polymer characterization; simulation-based thermal design; solder fatigue; solder reliability; thermal performance CFD modeling; thermal simulation; virtual thermal mechanical prototyping; wafer level thermal mechanical behavior;
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Conference_Location :
Brussels, Belgium
Print_ISBN :
0-7803-8420-2
DOI :
10.1109/ESIME.2004.1304003
