Title :
SMD inspection using structured light
Author :
Loh, Horng-Hai ; Lu, Ming-Sing
Author_Institution :
Dept. of Electr. Eng., Nat. Yunlin Inst. of Technol., Taiwan
Abstract :
Computer vision technology has been widely used in on-line inspection. In this paper, we present a computer vision system using structured light which provides us with an efficient relation for solder joint inspection. Our system uses a novel inspection technology to overcome some technology bottlenecks that traditional computer vision systems experienced. We focus the SMD inspection process on the solder joint defects in this paper. We developed a surface shape estimation technique for solder joint using a slant map. From this technique, a solder joint can be determined to be a good (concave), bad (convex), bridged solder joint, or solder joint with surplus solder, or lacking solder
Keywords :
automatic optical inspection; computer vision; image recognition; lighting; soldering; surface mount technology; SMD inspection; bad joint; bridged solder joint; computer vision system; good joint; on-line inspection; slant map; solder joint inspection; structured light; surface shape estimation technique; surplus solder; Computer vision; Data mining; Electronics industry; Inspection; Manufacturing processes; Printed circuits; Shape; Soldering; Surface tension; Surface-mount technology;
Conference_Titel :
Industrial Electronics, Control, and Instrumentation, 1996., Proceedings of the 1996 IEEE IECON 22nd International Conference on
Conference_Location :
Taipei
Print_ISBN :
0-7803-2775-6
DOI :
10.1109/IECON.1996.566028
