Title :
Injecting Memory Leaks to Accelerate Software Failures
Author :
Zhao, Jing ; Jin, Yuliang ; Trivedi, Kishor S. ; Matias, Rivalino, Jr.
Author_Institution :
Comput. Sci. & Tech. Dept., Harbin Eng. Univ., Harbin, China
fDate :
Nov. 29 2011-Dec. 2 2011
Abstract :
A number of studies have reported the phenomenon of "Software aging", caused by resource exhaustion and characterized by progressive software performance degradation. We develop experiments that simulate an on-line bookstore application, following the standard configuration of TPC-W benchmark. We study the application failures caused by memory leaks, using the accelerated life tests method. In our experiments, the memory consumption rate is selected as the acceleration factor, and an IPL-lognormal model is used to estimate the time to failure at each acceleration level. Subsequently, the estimate of the time to failure distribution at normal condition is obtained. Our acceleration experimental results based on the IPL-lognormal model show that it can be used to greatly reduce the cost to obtain the time to failure at normal level, which can be used in scheduling software rejuvenation. Finally, we select the Weibull time to failure distribution at normal level, to be used in a semi-Markov process, to optimize the software rejuvenation trigger interval.
Keywords :
Markov processes; Weibull distribution; benchmark testing; life testing; software reliability; IPL lognormal model; TPC-W benchmark; Weibull time; accelerated life tests method; failure distribution; memory leaks; online bookstore application; semi Markov process; software aging; software failure; software performance degradation; software rejuvenation; Acceleration; Aging; Java; Memory management; Stress; Web servers; accelerated life tests; memory leaks; optimal software rejuvenation; semi-Markov process; software aging;
Conference_Titel :
Software Reliability Engineering (ISSRE), 2011 IEEE 22nd International Symposium on
Conference_Location :
Hiroshima
Print_ISBN :
978-1-4577-2060-4
DOI :
10.1109/ISSRE.2011.24