Title :
1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)
Abstract :
The following topics were dealt with: ULSI technology; process integration; processing technology; power devices; submicron device structures and processing; advanced metallization and dielectrics; interconnect reliability; silicides; characterization and reliability; CMOS and BiCMOS ICs; mixed-signal circuits; submicron device modeling; circuit simulation; methodology and testing; electronic packaging: flip-chip solder joints and thermal design and stress; heterostructure devices; optoelectronics; compound semiconductor materials, characterization and processing; SOI materials, processing and devices; wafer bonding and smart-cut; SiGe films; diamond and other films; amorphous and poly-Si films; thermoelectrics; MEMS system integration, devices, sensors, and techniques
Keywords :
ULSI; integrated circuit bonding; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; integrated circuit technology; micromechanical devices; mixed analogue-digital integrated circuits; monolithic integrated circuits; optoelectronic devices; power electronics; semiconductor devices; semiconductor materials; semiconductor technology; semiconductor thin films; silicon-on-insulator; thermoelectricity; BiCMOS ICs; CMOS ICs; MEMS devices; MEMS sensors; MEMS system integration; SOI devices; SOI materials; SiGe films; ULSI technology; amorphous Si films; characterization; circuit simulation; compound semiconductor materials; diamond films; dielectrics; electronic packaging; flip-chip solder joints; heterostructure devices; interconnect reliability; metallization; mixed-signal circuits; optoelectronics; polysilicon films; power devices; process integration; processing technology; silicides; smart-cut; submicron device modeling; submicron device structures; testing; thermal design; thermal stress; thermoelectrics; wafer bonding;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing, China
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785758
