DocumentCode
3063261
Title
Flip-chip mounted silicon-based Impatt diodes for automotive applications
Author
Wollitzer, M. ; Strohm, K.M. ; Jorke, H. ; Luy, J.-F. ; Rasshofer, R.H. ; Biebl, E.M.
Author_Institution
Res. Center, Daimler-Benz AG, Ulm, Germany
Volume
3
fYear
1998
fDate
7-12 June 1998
Firstpage
1699
Abstract
We present the first silicon-based active antenna based on flip-chip mounted Impatt diodes. Our results show that flip-chip integration of Impatt diodes is a very promising alternative to monolithic integration since expected output power and heat removal is improved significantly. Compared to active antennas based on monolithic integration, the chip size of the novel flip-chip device is reduced by a factor of 50. Due to this fact, considerable reduction of manufacturing costs is expected.
Keywords
IMPATT diodes; active antennas; automotive electronics; elemental semiconductors; flip-chip devices; millimetre wave antennas; mobile antennas; silicon; Si; active antenna; automotive application; flip-chip integration; heat removal; manufacturing cost; output power; silicon IMPATT diode; Automotive applications; Automotive engineering; Contacts; Diodes; Fingers; Gold; Monolithic integrated circuits; Power generation; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location
Baltimore, MD, USA
ISSN
0149-645X
Print_ISBN
0-7803-4471-5
Type
conf
DOI
10.1109/MWSYM.1998.700707
Filename
700707
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