• DocumentCode
    3063261
  • Title

    Flip-chip mounted silicon-based Impatt diodes for automotive applications

  • Author

    Wollitzer, M. ; Strohm, K.M. ; Jorke, H. ; Luy, J.-F. ; Rasshofer, R.H. ; Biebl, E.M.

  • Author_Institution
    Res. Center, Daimler-Benz AG, Ulm, Germany
  • Volume
    3
  • fYear
    1998
  • fDate
    7-12 June 1998
  • Firstpage
    1699
  • Abstract
    We present the first silicon-based active antenna based on flip-chip mounted Impatt diodes. Our results show that flip-chip integration of Impatt diodes is a very promising alternative to monolithic integration since expected output power and heat removal is improved significantly. Compared to active antennas based on monolithic integration, the chip size of the novel flip-chip device is reduced by a factor of 50. Due to this fact, considerable reduction of manufacturing costs is expected.
  • Keywords
    IMPATT diodes; active antennas; automotive electronics; elemental semiconductors; flip-chip devices; millimetre wave antennas; mobile antennas; silicon; Si; active antenna; automotive application; flip-chip integration; heat removal; manufacturing cost; output power; silicon IMPATT diode; Automotive applications; Automotive engineering; Contacts; Diodes; Fingers; Gold; Monolithic integrated circuits; Power generation; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1998 IEEE MTT-S International
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-4471-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.1998.700707
  • Filename
    700707