Joule heating effect on evaluation of lifetime in electromigration experiment

Author

Sun, Yinghua ; Li, Zhi Guo ; Cheng, Yiao Hai ; Yuan, Ji

Author_Institution

Dept. of Electron. Eng., Beijing Polytech. Univ., China

fYear

1998

fDate

1998

Firstpage

230

Lastpage

233

Abstract

In this paper Joule heating effect of metallization in different widths and materials has been tested under varied current density stresses according to the relation of resistance and temperature of metal stripes. The high density current in the metal stripes created the great temperature increase due to Joule heating effect. It seriously affected evaluation of MTF and accuracy of current density exponent value in the metallization electromigration experiment. The MTF values have been corrected on the basis of the real temperature of stripes, and the corrected exponent n has been obtained

Keywords

current density; electromigration; integrated circuit metallisation; life testing; Joule heating effect; corrected exponent; current density exponent; current density stresses; electromigration; high density current; lifetime; metal stripes; metallization; metallization electromigration; resistance; temperature increase; Conductivity; Current density; Electromigration; Equations; Inorganic materials; Metallization; Resistance heating; Stress; System testing; Temperature dependence;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on

Conference_Location

Beijing

Print_ISBN

0-7803-4306-9

Type

conf

DOI

10.1109/ICSICT.1998.785861

Filename

785861