Title :
Properties of SOI-SIMNI films
Author :
Lu, Dian-Tong ; Ryssel, Heiner
Author_Institution :
Inst. of Low Energy Nucl. Phys., Beijing Normal Univ., China
Abstract :
SOI-SIMNI films were formed by different methods. The wafers were evaluated by means of IR, X-ray, SR, Hall-effect and DLTS studies. The three peak coefficients of IR spectra were calculated using our experimental data. A new nondestructive method is suggested to determine the thickness of a buried Si3N4 layer in a SOI-SIMNI film with IR spectra measurements. The X-ray diffraction lines were used to analyse the structure of the SOI-SIMNI films. The X-ray results proved that the buried silicon nitride layers are partly polycrystal α-Si3N4. The unit-cell contents are Si12N16 (28 atoms with hexagonal structure). Hall-effect measurements (4-300 K) show that in some SIMNI films, the carrier concentration of the surface silicon layers is much higher than the virgin substrate silicon; and the DLTS results indicated that there are some deep level defects Et=0.152 or 0.392 eV in the n-Si(100) surface layers of SOI-SIMNI films
Keywords :
Hall effect; X-ray diffraction; carrier density; deep level transient spectroscopy; deep levels; dielectric thin films; elemental semiconductors; infrared spectra; silicon; silicon compounds; silicon-on-insulator; 4 to 300 K; DLTS; Hall-effect; IR spectra; SOI-SIMNI films; Si3N4; SiO2-Si; X-ray diffraction; buried layer; carrier concentration; deep level defects; hexagonal structure; n-Si(100); nondestructive method; spreading resistivity; unit-cell contents; Electromagnetic wave absorption; Infrared spectra; Interference; Microscopy; Nitrogen; Semiconductor films; Silicon; Strontium; Thickness measurement; Transient analysis;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785882