DocumentCode
3064040
Title
The recent TEM application development for microelectronics
Author
Sheng, Tan Tsu ; Tung, Chih Hang ; Wang, John
Author_Institution
Inst. of Microelectron., Singapore
fYear
1998
fDate
1998
Firstpage
315
Lastpage
318
Abstract
Transmission electron microscopy (TEM) has played an important role in silicon VLSI/ULSI process evaluation and failure analysis. More recently, it has also been applied to micro-electro-machine system (MEMS), MCM, ...etc. In this talk, a few recent TEM application developments are presented. Some of these TEM applications may seem very difficult or impossible previously. These new applications are made possible by innovative sample preparation break through
Keywords
failure analysis; integrated circuit testing; specimen preparation; transmission electron microscopy; TEM application; failure analysis; micro-electro-machine system; microelectronics; process evaluation; transmission electron microscopy; Accelerometers; Biomembranes; Electron beams; Isolation technology; Microelectronics; Micromechanical devices; Oxidation; Silicon; Transmission electron microscopy; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.785884
Filename
785884
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