DocumentCode :
3067510
Title :
Quantifying Wafer Charging During Via Etch
Author :
Lukaszek, Wes ; Birrell, Andrew H.
Author_Institution :
Wafer Charging Monitors, Inc.
fYear :
1996
fDate :
13-14 May 1996
Firstpage :
30
Lastpage :
33
Keywords :
Charge measurement; Current measurement; EPROM; Etching; Resists; Sensor phenomena and characterization; Surface charging; Testing; Threshold voltage; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Process-Induced Damage, 1996 1st International Symposium on
Print_ISBN :
0-9651577-0-9
Type :
conf
DOI :
10.1109/PPID.1996.715196
Filename :
715196
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3067510
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