DocumentCode :
3070111
Title :
A New Methodology for Monitoring and Comparing Edge Exposure and Plasma Charging Current Damage from Plasma Processing
Author :
Fonash, S.J. ; Ozaita, M. ; Okandan, M. ; Awadelkarim, O.O. ; Chan, Y.D.
Author_Institution :
Pennsylvania State University
fYear :
1996
fDate :
14-14 May 1996
Firstpage :
84
Lastpage :
86
Keywords :
Annealing; Etching; MOSFETs; Monitoring; Plasma applications; Plasma devices; Plasma materials processing; Plasma measurements; Stress; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Process-Induced Damage, 1996 1st International Symposium on
Conference_Location :
Santa Clara, CA, USA
Print_ISBN :
0-9651577-0-9
Type :
conf
DOI :
10.1109/PPID.1996.715208
Filename :
715208
Link To Document :
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