• DocumentCode
    3072372
  • Title

    Low temperature epitaxial growth of indium phosphide

  • Author

    Chen, W. ; Yang, S.L. ; Liu, Pao-Lo

  • Author_Institution
    Dept. of Electrophys., Nat. Chiao-Tung Univ., Hsin-Chu, Taiwan
  • fYear
    1990
  • fDate
    23-25 April 1990
  • Firstpage
    116
  • Lastpage
    119
  • Abstract
    Low-temperature epitaxial growth of InP was achieved at a temperature as low as 330 degrees C using flow-rate modulation epitaxy (FME) with a thermal precracking technique. The growth systems was a modified metalorganic chemical vapor deposition (MOCVD) system. The growth rate decreased as the growth temperature was reduced. No clear transition temperature for mass-transport-limited and kinetic-limited regimes was observed, indicating that the highly reactive alkyl used greatly enhanced the surface reaction. The growth rate was probably limited by the supply of active reactants. Compared to the nominal FME growth process, the electron mobility was improved by a factor of two for InP homolayers grown at lower growth temperatures, i.e. from 330 degrees C to 450 degrees C. It was improved nearly sixfold in the case of InP/GaAs heteroepitaxial layers.<>
  • Keywords
    III-V semiconductors; carrier mobility; indium compounds; semiconductor epitaxial layers; semiconductor growth; vapour phase epitaxial growth; 330 degC; InP; InP-GaAs heteroepitaxial layers; MOCVD; electron mobility; flow-rate modulation epitaxy; growth rate; growth temperature; highly reactive alkyl; low temperature epitaxial growth; metalorganic chemical vapor deposition; surface reaction; thermal precracking technique; Chemical vapor deposition; Epitaxial growth; Hydrogen; Indium phosphide; Inductors; MOCVD; Optical materials; Plasma materials processing; Plasma temperature; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1990. Second International Conference.
  • Conference_Location
    Denver, CO, USA
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1990.202998
  • Filename
    202998