DocumentCode
3073128
Title
Infrared thermography of BGA´s heated by Focused Infrared Light Soldering System
Author
Felix, M. ; Anguiano, C. ; Medel, A. ; Bravo, Mikel ; Salazar, Daniel ; Marquez, Horacio
Author_Institution
Eng. Fac., Univ. Autonoma de Baja California, Mexico City, Mexico
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
323
Lastpage
325
Abstract
In this work, we present a thermal distribution measurement and analysis on the surface area of a Ball Grid Array (BGA), soldered by means of a Focused Infrared Light Soldering System (FILSS), which meets the BGA surface mount device (SMD) reflow solder heating profile.
Keywords
ball grid arrays; infrared imaging; reflow soldering; surface mount technology; BGA; FILSS; SMD; ball grid array; focused infrared light soldering system; infrared thermography; reflow solder heating profile; surface area; surface mount device; thermal distribution measurement; Cameras; Heat transfer; Infrared heating; Materials; Soldering; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420236
Filename
6420236
Link To Document