DocumentCode
3073376
Title
The applications of wafer vacuum laminator equipment in 3D-IC process technology
Author
Sheng-Yu Lin ; Ming-Tzung Chen ; Jeng-Ping Yang ; Pei-Wei Wang
Author_Institution
CSUN Manuf. Ltd., Hsinchu, Taiwan
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
315
Lastpage
319
Abstract
The technology of dry film laminator equipment has been developed in CSUN for more than a decade and widely adopted in PCB and Display industries.
Keywords
printed circuits; three-dimensional integrated circuits; 3D-IC process technology; PCB; display industries; dry film laminator equipment; wafer vacuum laminator equipment; Compounds; Filling; Films; Lamination; Liquids; Resists; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420250
Filename
6420250
Link To Document