DocumentCode
3073496
Title
Thermal simulation on typical high power diode packaging
Author
Zhong-Yi Wu ; Pei-Hsuan Wu ; Chiou, Tim ; Chen, Ru Shan ; Lee, Razak ; Ben-Je Lwo
Author_Institution
Dept. of Mechatron., Nat. Defense Univ., Taoyuan, Taiwan
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
343
Lastpage
346
Abstract
With the assistances from iteration methodology for heat dissipation property analyses and the effective material properties for the relatively complex PCB structures, this paper extracts the thermal resistance and the transient thermo-mechanical behaviors during reflow for two compactable high power diode packaging through the ANSYS software. After the simulations, further improvements on packaging structure designs were discussed according to the temperature and stress results.
Keywords
cooling; printed circuit design; semiconductor device packaging; semiconductor diodes; thermal resistance; ANSYS software; heat dissipation property analyses; high power diode packaging; iteration methodology; material properties; relatively complex PCB structures; thermal resistance; thermal simulation; transient thermo-mechanical behaviors; Finite element methods; Materials; Packaging; Stress; Thermal analysis; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420256
Filename
6420256
Link To Document