• DocumentCode
    3073633
  • Title

    Oxide field dependence of interface trap generation during negative bias temperature instability in PMOS

  • Author

    Denais, M. ; Huard, V. ; Parthasarathy, C. ; Ribes, G. ; Perrier, F. ; Revil, N. ; Bravaix, A.

  • Author_Institution
    STMicroelectronics, Crolles, France
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    109
  • Lastpage
    112
  • Abstract
    We focus in this study on the negative bias temperature instability (NBTI)-induced ΔNIT phenomenon and we point out its relative gate-oxide thickness (TOX) dependences. Studies are carried out in a large TOX range, comparing the gate-oxide quality which was grown with or without nitrogen incorporation. We have developed an oxide field (FOX) dependence for ΔNIT and we show the two opposite effects of TOX on the threshold voltage shift (ΔVT). Simulation of both effects shows a good correlation with experimental results in pure oxide and confirms the reduced interface trapped charge effect in ΔVT in nitrided devices. Results enable us to extrapolate the NBTI impact when TOX is varied which allows us to determine in a useful way the security margin during the gate-oxide process optimization.
  • Keywords
    MOSFET; interface states; nitridation; optimisation; semiconductor device measurement; semiconductor device models; semiconductor device reliability; thermal stability; N; NBTI gate-oxide thickness dependence; NBTI related reliability; PMOS; gate-oxide process optimization security margin; gate-oxide quality; interface trap generation; interface trapped charge effect reduction; negative bias temperature instability; nitrided devices; nitrogen incorporation; threshold voltage shift; trap generation oxide field dependence; Charge measurement; Current measurement; Negative bias temperature instability; Niobium compounds; Nitrogen; Stress measurement; Threshold voltage; Time measurement; Titanium compounds; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2004 IEEE International
  • Print_ISBN
    0-7803-8517-9
  • Type

    conf

  • DOI
    10.1109/IRWS.2004.1422750
  • Filename
    1422750