• DocumentCode
    3073732
  • Title

    Temperature uniformity simulation of vapor chamber

  • Author

    Shung-Wen Kang ; Jun-Ying Lin ; Chun-Hsien Huang ; Yu-Tang Chen

  • Author_Institution
    Dept. of Mech. & Electro-Mech. Eng., Tamkang Univ., Taipei, Taiwan
  • fYear
    2012
  • fDate
    24-26 Oct. 2012
  • Firstpage
    189
  • Lastpage
    192
  • Abstract
    In this study, temperature uniformity and heating rate of multi-well vapor chambers of different materials were simulated and analyzed by CFD software at natural convection condition. Heat sources with a total heating power of 1200W were uniformly distributed to six 30×30mm2 rectangular vapor chambers for heating. Model size of the vapor chamber is 112×75×17.2mm, and its structure is consisted of upper plate and lower plate. The upper plate is 13.2mm thick, and has 173 holes with a diameter of 5mm and a depth of 10mm for each. The lower plate is rectangular with a thickness of 4mm. The vapor chambers are made of four main materials: copper, silver, aluminum and vapor chambers. Temperature uniformity is assessed by comparing highest temperature differences of vapor chambers. The simulation results showed that the vapor chamber has better temperature uniformity than other materials because it has higher heat content, slower heating rate and higher coefficient of heat conduction. Thus, vapor chambers are a better choice in selection of vapor chambers.
  • Keywords
    aluminium; copper; heat conduction; heat sinks; silver; Ag; Al; CFD software; Cu; heat conduction; heating rate; lower plate; multiwell vapor chambers; natural convection condition; power 1200 W; rectangular vapor chambers; size 13.2 mm; size 4 mm; size 5 mm; temperature uniformity simulation; upper plate; Aluminum; Copper; DNA; Heating; Materials; Silver; Standards; heating rate; temperature uniformity; vapor chamber;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4673-1635-4
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2012.6420270
  • Filename
    6420270