DocumentCode
3074084
Title
Interconnect discussion group summary, IRW 2004
Author
Baozhen Li ; Girault, V.
fYear
2004
fDate
18-21 Oct. 2004
Firstpage
192
Lastpage
192
Keywords
Adhesives; Aluminum; Conductivity; Copper; Dielectrics; Electromigration; Integrated circuit interconnections; Microelectronics; Testing; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2004 IEEE International
Print_ISBN
0-7803-8517-9
Type
conf
DOI
10.1109/IRWS.2004.1422774
Filename
1422774
Link To Document