Novel method of Wafer Level Packaging in the field of MEMS

Wafer Level Packaging (WLP), a new packaging technology which is dedicated to integrated circuit (IC) packaging at wafer level to replace die level packaging. WLP basically includes front-end IC foundry process and back-end device packaging process. The major benefits of WLP contain manufacture period shortening, product size reduction, and production cost down, all have been aligned with the latest trend in semiconductor evolution. WLP has already been a popular packaging technology in IC packaging field in recent years, especially in Micro-Electro-Mechanical System (MEMS) area, because of its characteristic and various applications. Some advanced technologies are contributed from WLP, such as wafer backside lapping, wafer sawing, wafer level wire bonding, wafer level compound molding, and compound lapping.