DocumentCode
3074441
Title
Electroplating through holes with different geometry -- A novel and high productivity process for through hole fill plating
Author
Najjar, Elie ; Barstad, L. ; Nagarajan, J. ; Lin, Man ; Rzeznik, M. ; Lefebvre, M.
Author_Institution
Dow Electron. Mater., Dow Chem. Co., Marlborough, MA, USA
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
255
Lastpage
258
Abstract
A novel DC through hole filling process was formulated for high volume HDI and substrate core layer metallization production. The process yields high quality results over a wide current density range.
Keywords
electroplating; metallisation; printed circuit interconnections; DC through hole filling process; electroplating; high productivity process; high volume HDI; substrate core layer metallization production; through hole fill plating; Additives; Chemistry; Copper; Current density; Filling; Reliability; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420311
Filename
6420311
Link To Document