• DocumentCode
    3074497
  • Title

    Sensitivity analysis of voltage dip computations using the TEF methods

  • Author

    Debs, A.S. ; Domínguez, F.

  • Author_Institution
    Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    1990
  • fDate
    5-7 Dec 1990
  • Firstpage
    3031
  • Abstract
    The author previously (1989) demonstrated that the lowest voltage dip in a power system following a disturbance occurs when the system trajectory attains maximal transient potential energy. In this paper, the first-order sensitivity of this potential energy is derived and then extended to predict directly a margin for voltage dip stability. The benefit of this is the ability to predict a host of operating margins for a power system, such as generation levels, reactive power levels, and others that keep the system in a secure operating state following given disturbance contingencies. Studies done in a 39-bus system indicate that the voltage dip behaves in a nearly linear fashion for variations in the given network parameters. Even in the case of large variations in these parameters, the error produced by assuming a linear behavior is acceptable. The need for second-order sensitivity expressions is not seen, and they might be required only in some cases where improved accuracy is desired
  • Keywords
    power systems; sensitivity analysis; stability; transients; 39-bus system; first-order sensitivity; generation levels; maximal transient potential energy; operating margin prediction; reactive power levels; sensitivity analysis; transient energy function methods; voltage dip stability; Electronics packaging; Equations; Potential energy; Power system analysis computing; Power system stability; Power system transients; Sensitivity analysis; Time domain analysis; Transmission line matrix methods; Voltage fluctuations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Decision and Control, 1990., Proceedings of the 29th IEEE Conference on
  • Conference_Location
    Honolulu, HI
  • Type

    conf

  • DOI
    10.1109/CDC.1990.203340
  • Filename
    203340