• DocumentCode
    3078030
  • Title

    Analysis of thermal effects on crosstalk and performance of optoelectronic transmitter modules

  • Author

    Ukaegbu, Ikechi Augustine ; Sangirov, Jamshid ; Lee, Tae-Woo ; Cho, Mu Hee ; Park, Hyo-Hoon

  • Author_Institution
    Electr. Eng. Dept., KAIST, Daejeon, South Korea
  • fYear
    2012
  • fDate
    2-6 July 2012
  • Firstpage
    537
  • Lastpage
    538
  • Abstract
    In this work, an analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic modules for reliable data transmission.
  • Keywords
    electronics packaging; optical crosstalk; optical interconnections; optical transmitters; optoelectronic devices; crosstalk; data transmission; interconnect parameters; multichannel optoelectronic modules; optoelectronic transmitter modules; packaging; thermal critical frequency; thermal effects; Crosstalk; Optical crosstalk; Optical interconnections; Optical transmitters; Reliability; Thermal analysis; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Opto-Electronics and Communications Conference (OECC), 2012 17th
  • Conference_Location
    Busan
  • ISSN
    2166-8884
  • Print_ISBN
    978-1-4673-0976-9
  • Electronic_ISBN
    2166-8884
  • Type

    conf

  • DOI
    10.1109/OECC.2012.6276560
  • Filename
    6276560
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3078030