• DocumentCode
    3078352
  • Title

    [Title page]

  • Author

    Lukasiewycz, Martin ; Chakraborty, Shiladri ; Milbredt, Paul

  • Author_Institution
    Tech. Univ. Munich, Munich, Germany
  • fYear
    2011
  • fDate
    14-18 March 2011
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The following topics are dealt with: system-level techniques to handle performance, reliability and thermal issue; modeling and simulation of interconnects; transient faults and soft errors; networked embedded system; multi-core architecture; formal verification engine; predicting bugs generating test; digital baseband processing; three-dimensional IC; QoS guaranteed NoCs; and ultra low power smart devices.
  • Keywords
    electronic design automation; formal verification; logic design; low-power electronics; microprocessor chips; multiprocessing systems; network-on-chip; three-dimensional integrated circuits; NoC; QoS; digital baseband processing; formal verification engine; multicore processor; networked embedded system; soft error; system-level technique; three-dimensional IC; transient fault; ultra low power smart devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011
  • Conference_Location
    Grenoble
  • ISSN
    1530-1591
  • Print_ISBN
    978-1-61284-208-0
  • Type

    conf

  • DOI
    10.1109/DATE.2011.5763003
  • Filename
    5763003
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3078352