Title :
Signal integrity evaluation of segmental transmission line under real-world application
Author :
Inoue, H. ; Yasunaga, Moritoshi ; Kanazawa, Kenji ; Aibe, Noriyuki
Author_Institution :
Grad. Sch. of Syst. & Inf. Eng., Univ. of Tsukuba, Tsukuba, Japan
Abstract :
We have proposed a novel transmission line structure called “segmental transmission line (STL)” in order to ensure high signal integrity (SI) in PCB traces already and we have also shown its high SI improvement capability in eye-diagrams. In this paper, we evaluate the STL from the real-world application view point for the first time, which is indispensable for next development step. As one of applications, we choose image-data transmission at 5 Gbps and 7.5 Gbps data-rate, and demonstrate that the STL can transmit much higher quality image-data than the conventional transmission line by not only simulations but by a 500 Mbps STL scale-up prototype. We also calculate bit error rates (BERs) and show that BERs in the conventional transmission line decrease to 1/14 and 1/25 at 5 Gbps and 7.5 Gbps, respectively in the STL.
Keywords :
error statistics; printed circuit design; BER; PCB; bit error rates; bit rate 5 Gbit/s; bit rate 500 Mbit/s; bit rate 7.5 Gbit/s; eye-diagrams; image-data transmission; segmental transmission line; signal integrity evaluation; Bit error rate; Field programmable gate arrays; Image reconstruction; Image segmentation; Microstrip; Prototypes; Silicon; bit error rate; image transmission; printed circuit board; segmental transmission line; signal integrity;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location :
Nara
Print_ISBN :
978-1-4799-2313-7
DOI :
10.1109/EDAPS.2013.6724401