DocumentCode
3084294
Title
Early chip planning cockpit
Author
Shin, Jeonghee ; Darringer, John A. ; Luo, Guojie ; Weger, Alan J. ; Johnson, Charles L.
Author_Institution
IBM T. J. Watson Res., Yorktown Heights, NY, USA
fYear
2011
fDate
14-18 March 2011
Firstpage
1
Lastpage
4
Abstract
The design of high-performance servers has always been a challenging art. Now, server designers are being asked to explore a much larger design space as they consider multicore heterogeneous architecture and the limits of advancing silicon technology. Bringing automation to the early stages of design can enable more rapid and accurate trade-off analysis. In this paper, we introduce an Early Chip Planner which allows designers to rapidly analyze microarchitecture, physical and package design trade-offs for 2D and 3D VLSI chips and generates an attributed netlist to be carried on to the implementation stage. We also describe its use in planning a 3D special-purpose server processor.
Keywords
VLSI; microprocessor chips; multiprocessing systems; VLSI chips; early chip planning cockpit; microarchitecture; server processor; silicon technology; Chip scale packaging; Microarchitecture; Planning; Servers; Thermal analysis; Three dimensional displays; Through-silicon vias; early chip planning; system level design automation;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011
Conference_Location
Grenoble
ISSN
1530-1591
Print_ISBN
978-1-61284-208-0
Type
conf
DOI
10.1109/DATE.2011.5763292
Filename
5763292
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