• DocumentCode
    3084294
  • Title

    Early chip planning cockpit

  • Author

    Shin, Jeonghee ; Darringer, John A. ; Luo, Guojie ; Weger, Alan J. ; Johnson, Charles L.

  • Author_Institution
    IBM T. J. Watson Res., Yorktown Heights, NY, USA
  • fYear
    2011
  • fDate
    14-18 March 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The design of high-performance servers has always been a challenging art. Now, server designers are being asked to explore a much larger design space as they consider multicore heterogeneous architecture and the limits of advancing silicon technology. Bringing automation to the early stages of design can enable more rapid and accurate trade-off analysis. In this paper, we introduce an Early Chip Planner which allows designers to rapidly analyze microarchitecture, physical and package design trade-offs for 2D and 3D VLSI chips and generates an attributed netlist to be carried on to the implementation stage. We also describe its use in planning a 3D special-purpose server processor.
  • Keywords
    VLSI; microprocessor chips; multiprocessing systems; VLSI chips; early chip planning cockpit; microarchitecture; server processor; silicon technology; Chip scale packaging; Microarchitecture; Planning; Servers; Thermal analysis; Three dimensional displays; Through-silicon vias; early chip planning; system level design automation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011
  • Conference_Location
    Grenoble
  • ISSN
    1530-1591
  • Print_ISBN
    978-1-61284-208-0
  • Type

    conf

  • DOI
    10.1109/DATE.2011.5763292
  • Filename
    5763292