DocumentCode
3086880
Title
Surface laminar circuit packaging
Author
Tsukada, Yutaka ; Tsuchida, Syuhei ; Mashimoto, Yohko
Author_Institution
IBM Japan, Shiga, Japan
fYear
1992
fDate
18-20 May 1992
Firstpage
22
Lastpage
27
Abstract
Discusses the SLC (surface laminar circuit), a component carrier technology which satisfies various requirements for packaging of small computers through its surface laminar structure, which is similar to semiconductor wiring. By utilizing photo via holes instead of plated through holes for signal line connection, SLC has a high wiring density which allows it to carry bare chips directly attached on the SLC by flip chip attach. This packaging technology has an extended reliability compared with conventional flip chip bonding and a wide range of application in small computers
Keywords
circuit reliability; flip-chip devices; packaging; wiring; SLC; bare chips; component carrier technology; flip chip attach; packaging; photo via holes; reliability; signal line connection; small computers; surface laminar circuit; wiring density; Application software; Bonding; Conductors; Costs; Electronics packaging; Flip chip; Pins; Printed circuits; Surface-mount technology; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204177
Filename
204177
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