Title :
Magnetic wireless interlayer transmission through perpendicular MTJ for 3D-IC applications
Author :
Ching-Hua Wang ; Kun-Yu Dai ; Kuei-Hung Shen ; Yung-Hung Wang ; Ming-Jinn Tsai ; Chrong Jung Lin ; Ya-Chin King
Author_Institution :
Microelectron. Lab., Nat. Tsing-Hua Univ. (NTHU), Hsinchu, Taiwan
Abstract :
A new wireless 3D IC connection method, Magnetic-sensing Transmission Interface (MTI), is reported, for the first time. MTI implemented by placing a high-sensitivity sensor with perpendicular magnetic anisotropy on the top of a micro-coil is successfully demonstrated. This new contactless connection scheme offers low-power, wide-bandwidth and multi-layer wireless data transmission for 3D ICs.
Keywords :
coils; low-power electronics; magnetic anisotropy; magnetic sensors; magnetic tunnelling; three-dimensional integrated circuits; MTI; high-sensitivity sensor; magnetic tunneling junction; magnetic wireless interlayer transmission; magnetic-sensing transmission interface; microcoil; multilayer wireless data transmission; perpendicular MTJ; perpendicular magnetic anisotropy; wireless 3D IC connection method; Coils; Linearity; Magnetic fields; Magnetic tunneling; Resistance; Sensitivity; Three-dimensional displays;
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
DOI :
10.1109/IEDM.2013.6724689
