• DocumentCode
    3089085
  • Title

    Rapid thermal curing of BCB dielectric

  • Author

    Garrou, P.E. ; Heistand, R.H. ; Dibbs, M. ; Manial, T.A. ; Mohler, C. ; Stokich, T. ; Townsend, P.H. ; Adema, G.M. ; Berry, M.J. ; Turlik, I.

  • Author_Institution
    Dow Chemical USA, Charlotte, NC, USA
  • fYear
    1992
  • fDate
    18-20 May 1992
  • Firstpage
    770
  • Lastpage
    775
  • Abstract
    The authors demonstrate the feasibility of rapid thermal curing (RTC) of benzocyclobutene (BCB) thin films using an infrared belt furnace. The effects on film properties resulting from a dramatic reduction in cure time (5 h to 5 min) are summarized. The extent of cure was determined by FTIR (Fourier-transform infrared spectroscopy) and was subsequently modeled as a function of reaction kinetics using the measured temperature profiles. FTIR spectra from the RTC films were identical to those obtained using a conventional inert gas oven and a convectively heated belt furnace, indicating that: (1) the polymerization mechanisms and the resulting polymer network structure are identical, and (2) no chemical enhancement of the curing occurs due to the absorption of infrared radiation. There are no statistically significant differences in the resulting stress and adhesion properties for samples cured by the RTC process vs. the conventional process for film thicknesses ranging from 1 to 24 μm. Planarization measurements, made on isolated features up to 100 μm in width, also indicate no differences in the cured films
  • Keywords
    multichip modules; polymer films; polymer structure; polymerisation; rapid thermal processing; reaction kinetics; spectrochemical analysis; 1 to 24 micron; 5 min; FTIR spectra; MCM; benzocyclobutene thin films; cure time; infrared belt furnace; planarisation; polymer network structure; polymerization mechanisms; rapid thermal curing; reaction kinetics; temperature profiles; Belts; Curing; Dielectric thin films; Furnaces; Infrared heating; Infrared spectra; Kinetic theory; Ovens; Polymer films; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1992. Proceedings., 42nd
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-0167-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1992.204292
  • Filename
    204292