Optoelectronic chips and multichip modules

Author

Jannson, Tomasz ; Chen, Ray ; Lin, Freddie

Author_Institution

Phys. Optics Corp., Torrance, CA, USA

fYear

1992

fDate

18-20 May 1992

Firstpage

804

Lastpage

806

Abstract

A novel concept of optoelectronic chips and multichip modules (MCMs) is presented. This concept is based on direct integration of single-mode optoelectronics with VLSI/ULSI CMOS technology. This concept allows direct communication between silicon chips and modules without implementing GaAs electronics. External electrooptic (EO) modulators and silicon photodetectors are used as transceivers while optical power is provided by continuous wave (CW) laser diodes (LDs). In analogy with multilayer MCM electrical interconnects, multilayer optical interconnects are provided in the form of polymeric light-distributing interconnect-active (LIDIA) substrates. As a result, the integrated waveguide technology is monolithically integrated through LIDIA intrachip, chip-to-chip, and module-to-module substrates with silicon MCM circuitry

Keywords

CMOS integrated circuits; VLSI; integrated optoelectronics; multichip modules; optical interconnections; Si photodetectors; VLSI/ULSI CMOS technology; direct integration; external electrooptic modulators; integrated waveguide technology; monolithically integrated; multichip modules; multilayer optical interconnects; optoelectronic chips; polymeric light-distributing interconnect-active; single-mode optoelectronics; substrates; transceivers; CMOS technology; Electrooptic modulators; Integrated circuit interconnections; Multichip modules; Nonhomogeneous media; Optical interconnections; Optical polymers; Optical waveguides; Silicon; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204298

Filename

204298