• DocumentCode
    3089666
  • Title

    Atomic-level engineering of phase change material for novel fast-switching and high-endurance PCM for storage class memory application

  • Author

    Cheng, H.Y. ; BrightSky, M. ; Raoux, S. ; Chen, C.F. ; Du, P.Y. ; Wu, J.Y. ; Lin, Y.Y. ; Hsu, T.H. ; Zhu, Yujia ; Kim, Sungho ; Lin, Chiung M. ; Ray, Avik ; Lung, H.L. ; Lam, Chris

  • Author_Institution
    Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    9-11 Dec. 2013
  • Abstract
    Storage class memory (SCM) does not need long data retention (since the data are refreshed regularly) but has very stringent requirements on read/write speed and cycling endurance. Even though phase change memory (PCM) is a leading candidate currently no phase change material can satisfy both speed and endurance requirements. This is because although GST-225 is a fast switching material it suffers large volume change when melting thus limited cycling endurance. Attempts to improve the endurance so far must sacrifice switching speed. This work explores new phase change material by atomic-level engineering the doping to GST. The resulting new phase-change material has demonstrated fast switching speed of 20 ns, long endurance of 1G cycles and low reset current of 150 μA in a 128 Mb test chip. Its data retention passed 20 years-55°C criteria with failure rate lower than 10ppm.
  • Keywords
    antimony compounds; germanium compounds; phase change materials; phase change memories; semiconductor doping; Ge2Sb2Te5; atomic level engineering; current 150 muA; cycling endurance; fast switching PCM; high endurance PCM; phase change material; phase change memory; storage capacity 128 Mbit; storage class memory application; Atomic layer deposition; Doping; Phase change materials; Sputtering; Switches; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2013 IEEE International
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/IEDM.2013.6724726
  • Filename
    6724726