The thermal management of IBM´s ES/9000 advanced thermal conduction module

Author

Hopper, Gregory S. ; Edwards, David L. ; Young, Steven P.

Author_Institution

IBM Technol. Products, Hopewell Junction, NY, USA

fYear

1992

fDate

18-20 May 1992

Firstpage

997

Lastpage

1001

Abstract

The Advanced Thermal Conduction Module (ATCM) used in the IBM ES/9000 mainframe models 820 and 900 represents a major step forward in high end thermal management. Advanced design, sophisticated modeling, application of new materials, thorough testing, and joint development with manufacturing have resulted in a threefold increase in cooling capability over the TCM in the 3090. The use of a composite heat transfer coefficient is introduced and used to compare several thermal designs. The authors describe the ATCM technology, design process, and qualification activity that led to the introduction of the ATCM

Keywords

IBM computers; cooling; heat transfer; mainframes; modules; IBM ES/9000 mainframe models; advanced thermal conduction module; composite heat transfer coefficient; cooling capability; design process; high end thermal management; qualification activity; thermal management; Conducting materials; Cooling; Heat transfer; Joining materials; Materials testing; Process design; Qualifications; Thermal conductivity; Thermal management; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204327

Filename

204327