Thermal analysis for high-performance small devices

The burgeoning influence of data networks in society has aroused rapid increases in customer´s interest on portable electronic equipment which is available anytime and anywhere, stimulating the use of high-speed MPU´s (micro processing units) in portable products. The development of these types of products would be difficult without first developing high-efficiency thermal dissipation technologies or without the aid of thermal analysis technologies. Even in PFU we are developing a credit-card sized condensed processor with PC/AT compatible functions for car navigation systems, factory automation, and point of sale industries, etc., a product wherein these same thermal management issues comes into play. To this end, we are developing new packaging technologies such as CSP (Chipscale Package), enabling smaller and lighter products, we are also developing thermal analysis technologies capable of analysing thermal dissipation technologies including thermal diffusion methods, thermal analysis technologies capable of dealing with the frequent rate of change of the designer´s request. In this paper we focus on thermal analysis technologies (i.e. thermal analysis technologies based on the finite volume method (FVM)) as the key to solving the card processor thermal dissipation problems. We propose a thermal analysis model construct and a calculation mesh partition method that are effective for design, and report the results of applying and verifying these model in a card processor unit that includes an i486DX4 (100 MHz)