Low temperature fabrication and characterization of integrated packaging-compatible, ferrite-core magnetic devices

Author

Park, Jae Y. ; Allen, Mark G.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

1

fYear

1997

fDate

23-27 Feb 1997

Firstpage

361

Abstract

Integrated magnetic components compatible with organic (low-temperature) electronic packaging for miniature DC/DC converters and other power supply applications are investigated. Two inductor types have been fabricated incorporating a polymer/ferrite composite core, deposited and patterned at low temperature. For the fabricated inductors, inductances in the 0.5-1.5 μH range and Q-factors of the order of 17 are achieved. In all cases, the incorporation of the polymer filled ferrite improved the characteristics of the integrated inductors

Keywords

DC-DC power convertors; Q-factor; ferrite devices; inductors; magnetic cores; packaging; polymers; power supplies to apparatus; Q-factors; ferrite-core magnetic devices; inductances; inductors; integrated packaging-compatible devices; low temperature characterisation; low temperature fabrication; low-temperature electronic packaging; miniature DC/DC converters; polymer/ferrite composite core; power supply; DC-DC power converters; Electronics packaging; Fabrication; Ferrites; Inductors; Magnetic cores; Polymers; Power supplies; Q factor; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 1997. APEC '97 Conference Proceedings 1997., Twelfth Annual

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-3704-2

Type

conf

DOI

10.1109/APEC.1997.581476

Filename

581476