DocumentCode
3092995
Title
Temperature uniformity of microdroplet heated by Rayleigh Surface Acoustic Wave in view of biological reaction
Author
Roux-Marchand, T. ; Beyssen, D. ; Sarry, F. ; Elmazria, O.
Author_Institution
Inst. Jean Lamour, Univ. de Lorraine, Vandoeuvre-les-Nancy, France
fYear
2013
fDate
21-25 July 2013
Firstpage
1885
Lastpage
1888
Abstract
In this paper, we have studied the temperature uniformity of microdroplet heated by Rayleigh surface acoustic wave for discrete microfluidic applications such as biological reactions. A longitudinal wave is radiated into the liquid placed on the wave path and induces the well known surface acoustic wave streaming. To precisely ascertain the temperature uniformity, we have used a non-contact method based on infraed thermography so as to not interfer with the biological reaction. We then have tested the temperature uniformity as a function of three parameters: the microdroplet volume, the Rayleigh surface acoustic wave frequency and the injected power. Based on these results, we propose a new device structure to develop a futur lab on chip based temperature reaction.
Keywords
Rayleigh waves; acoustic streaming; bioMEMS; biochemistry; biological techniques; chemical reactions; drops; heating; infrared imaging; lab-on-a-chip; microfluidics; surface acoustic wave devices; surface acoustic waves; thermochemistry; Rayleigh surface acoustic wave frequency; biological reaction; discrete microfluidic applications; infrared thermography; injected power value; lab on chip based temperature reaction; longitudinal wave radiation; microdroplet heating; microdroplet temperature uniformity; microdroplet volume; noncontact method; surface acoustic wave device structure; surface acoustic wave streaming; wave path; Heating; Liquids; Microfluidics; Standards; Surface acoustic waves; Temperature measurement; SAW streaming; Surface Acoustic Wave (SAW); biological reaction; microdroplet heating; temperature uniformity;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location
Prague
ISSN
1948-5719
Print_ISBN
978-1-4673-5684-8
Type
conf
DOI
10.1109/ULTSYM.2013.0480
Filename
6724873
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