Title :
Three-dimensional fusion of Shear Wave Imaging and electro-anatomical mapping for intracardiac radiofrequency ablation monitoring
Author :
Hollender, Peter ; Rosenzweig, Stephen ; Eyerly, Stephanie ; Wolf, Philip ; Trahey, Gregg
Author_Institution :
Dept. of Biomed. Eng., Duke Univ., Durham, NC, USA
Abstract :
Electroanatomical Mapping (EAM) provides electrophysiologists with a three-dimensional visualization of endocardial geometry and electrical activity, used to guide transcatheter ablation (TCA) treatment of arrhythmia. Acoustic Radiation Force Impulse (ARFI) and Shear Wave Imaging (SWI) are ultrasonic methods of imaging the mechanical properties of the myocardium that may allow direct visualization of ablation lesion formation, and can be acquired with Intracardiac Echocardiography (ICE) imaging catheters, which are commonly used to guide TCA. The mechanical substrate mapping holds promise to complement the electrical data to improve the safety and efficacy of the procedure. This work demonstrates the use of an image fusion system to stitch a series of in vivo planar ARFI or SWI images together into a 3-D volume of substrate elasticity.
Keywords :
bioelectric phenomena; biological tissues; biomechanics; biomedical ultrasonics; catheters; echocardiography; elastic waves; elasticity; image fusion; medical image processing; patient monitoring; ultrasonic therapy; 3-D volume; TCA treatment; ablation lesion formation; acoustic radiation force impulse; arrhythmia; catheters; electrical activity; electrical data; electroanatomical mapping; endocardial geometry; in vivo planar ARFI images; in vivo planar SWI images; intracardiac echocardiography imaging; intracardiac radiofrequency ablation monitoring; mechanical properties; mechanical substrate mapping; myocardium; shear wave imaging; substrate elasticity; three-dimensional image fusion; three-dimensional visualization; transcatheter ablation treatment; ultrasonic methods; Acoustics; Catheters; Imaging; Lesions; Myocardium; Radio frequency; Ultrasonic imaging;
Conference_Titel :
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location :
Prague
Print_ISBN :
978-1-4673-5684-8
DOI :
10.1109/ULTSYM.2013.0028