• DocumentCode
    30965
  • Title

    K-band bandpass filter using fully micromachined substrate integrated waveguide platform with dual copper posts in glass dielectrics

  • Author

    Ik-Jae Hyeon ; Chang-Wook Baek

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Chung-Ang Univ., Seoul, South Korea
  • Volume
    51
  • Issue
    16
  • fYear
    2015
  • fDate
    8 6 2015
  • Firstpage
    1268
  • Lastpage
    1270
  • Abstract
    A K-band bandpass filter (BPF) based on the fully micromachined substrate integrated waveguide (SIW) structure has been demonstrated. In the proposed SIW platform, borosilicate glass reflowed into the silicon trench is used as a dielectric substrate, and the vias are formed by filling the glass mould with electroplated copper after removing the embedded silicon part. The BPF´s characteristics are realised by introducing dual inductive post structures into the SIW platform. The insertion loss and 3 dB bandwidth of the fabricated BPF were measured to be 2.46 dB at 29 GHz and 7.2%, respectively. The proposed BPF platform has high potential for low-loss, compact SIW-based millimetre-wave tunable filters owing to its mechanical robustness and integrity with MEMS tuning devices.
  • Keywords
    band-pass filters; dielectric materials; micromachining; micromechanical devices; substrate integrated waveguides; vias; waveguide filters; BPF characteristics; K-band bandpass filter; MEMS tuning devices; SIW structure; borosilicate glass; dielectric substrate; dual copper posts; dual inductive post structures; electroplated copper; frequency 29 GHz; fully micromachined substrate integrated waveguide platform; glass dielectrics; glass mould; loss 2.46 dB; low-loss compact SIW-based millimetre-wave tunable filters; silicon trench; vias;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2015.0921
  • Filename
    7175160