DocumentCode
309682
Title
A new ultrasonic technique for the interfacial characterization of adhesive joints
Author
Moidu, Abduljaleel K. ; Sinclair, Anthony N. ; Spelt, Jan K.
Author_Institution
Dept. of Mech. & Ind. Eng., Toronto Univ., Ont., Canada
Volume
1
fYear
1996
fDate
3-6 Nov 1996
Firstpage
757
Abstract
A focused, oblique incidence ultrasonic measurement system for the interfacial characterization of adhesive bonds is presented. The angular spectrum approach is used to model the response of the measurement system. The predictions of the model are compared with measurements on two extreme cases of adhesive bonds, using a specially developed transducer. It is shown that an interference pattern is obtained in the frequency spectrum, depending on the relative distance of the transmitter-receiver pair with respect to the specimen. Results from the two extreme cases suggest that the interference phenomenon increases the sensitivity of ultrasonic waves to the interfacial properties
Keywords
adhesion; ultrasonic materials testing; adhesive joint; angular spectrum; focused oblique incidence ultrasonic measurement; frequency spectrum; interfacial bonds; interference; transducer; Adhesives; Frequency; Industrial engineering; Interference; Predictive models; Probes; Reflection; Ultrasonic imaging; Ultrasonic transducers; Ultrasonic variables measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1996. Proceedings., 1996 IEEE
Conference_Location
San Antonio, TX
ISSN
1051-0117
Print_ISBN
0-7803-3615-1
Type
conf
DOI
10.1109/ULTSYM.1996.584083
Filename
584083
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