DocumentCode :
3097784
Title :
Normally-off InAlN/GaN HEMTs with n++ GaN cap layer: A simulation study
Author :
Vitanov, Stanislav ; Kuzmik, J. ; Palankovski, Vassil
Author_Institution :
Adv. Mater. & Device Anal. Group, Tech. Univ. Vienna, Vienna, Austria
fYear :
2011
fDate :
7-9 Dec. 2011
Firstpage :
1
Lastpage :
2
Abstract :
The ongoing interest in the development of GaN-based enhancement-mode high electron mobility transistors (EHEMTs) resulted in several different approaches being proposed, one of them employing a reduction of the gate-to-channel distance. In order to facilitate gate recessing, a technique using a n++ cap layer was suggested by Kuzmik et al., who also analyzed the contribution of the cap layer to current conduction and on the mechanism of the off-state breakdown. In this work we complement the experimental results with two-dimensional device simulation using Minimos-NT. We have employed it previously for the optimization studies of a whole generation of AlGaN/GaN HEMTs, but also for high-temperature simulations.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; wide band gap semiconductors; InAlN-GaN; Minimos-NT; current conduction; gate-to-channel distance; high-temperature simulations; n++ cap layer technique; normally-off HEMT; off-state breakdown; two-dimensional device simulation; Current density; Electric fields; Gallium nitride; HEMTs; Integrated circuit modeling; Logic gates; MODFETs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Device Research Symposium (ISDRS), 2011 International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4577-1755-0
Type :
conf
DOI :
10.1109/ISDRS.2011.6135161
Filename :
6135161
Link To Document :
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