Title :
Fast simulation of nonuniform substrate temperature effects on global GSI interconnects
Author :
Jiaqing Lu ; Min Tang ; Junfa Mao
Author_Institution :
Key Lab. of Minist. of Educ., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
An efficient method for transient analysis of on-chip coupled interconnects is presented considering nonuniform temperature profiles of the underlying substrate. The parametric macromodeling technique is performed to take into account the effects of substrate temperature. The waveform relaxation with transverse partitioning algorithm is employed for fast transient simulation of large coupled interconnects. With the proposed method, the impact of typical substrate thermal profiles on the performance of on-chip global interconnects is investigated. The efficiency and accuracy of the proposed method is demonstrated by a numerical example.
Keywords :
coupled circuits; integrated circuit interconnections; iterative methods; transient analysis; fast transient simulation analysis; gigascale integration; global GSI interconnection; nonuniform substrate temperature effect; nonuniform temperature profile; numerical method; on-chip coupled interconnection; parametric macromodeling technique; substrate thermal profile; transverse partitioning algorithm; waveform relaxation; Algorithm design and analysis; Analytical models; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Substrates; Transient analysis; Nonuniform substrate temperature effects; interconnect; parametric macromodel; transient analysis;
Conference_Titel :
Microwave Conference Proceedings (APMC), 2012 Asia-Pacific
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-4577-1330-9
Electronic_ISBN :
978-1-4577-1331-6
DOI :
10.1109/APMC.2012.6421782
