DocumentCode :
3099788
Title :
Experimental study of gate voltage scaling for TDDB under direct tunneling regime
Author :
Takayanagi, Mariko ; Takagi, Shin-ichi ; Toyoshima, Yoshiaki
Author_Institution :
Syst. LSI Res. & Dev. Center, Toshiba Corp., Yokohama, Japan
fYear :
2001
fDate :
2001
Firstpage :
380
Lastpage :
385
Abstract :
Systematic experiments of time-to-breakdown (TBD) of thin gate oxides are carried out in this paper for quantitative understanding of gate voltage scaling for TDDB under the direct tunneling regime. It is found that the slope of ln TBD has a nonlinear relationship to gate oxide voltage, Vox, and thus, the conventional constant voltage acceleration model is not applicable for lifetime prediction. A simple model to explain the experimental voltage acceleration factor is proposed based on the anode hole injection (AHI) concept. It is shown that the significant decrease in hole generation due to lowering of the electron energy injected to the anode greatly helps the TDDB reliability
Keywords :
MOS capacitors; MOSFET; dielectric thin films; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; semiconductor device testing; tunnelling; CMOSFETs; MOS capacitors; SiO2-Si; TDDB; TDDB reliability; anode hole injection; constant voltage acceleration model; direct tunneling regime; electron energy injection; gate oxide voltage; gate voltage scaling; hole generation; lifetime prediction; thin gate oxides; time-to-breakdown; voltage acceleration factor; Acceleration; Anodes; Breakdown voltage; Charge carrier processes; Dielectric breakdown; Laboratories; Large scale integration; Predictive models; Stress; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2001. Proceedings. 39th Annual. 2001 IEEE International
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-6587-9
Type :
conf
DOI :
10.1109/RELPHY.2001.922930
Filename :
922930
Link To Document :
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