• DocumentCode
    310032
  • Title

    Studies on solder self-alignment

  • Author

    Lee, Y.C.

  • Author_Institution
    Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
  • Volume
    1
  • fYear
    1994
  • fDate
    31 Oct-3 Nov 1994
  • Firstpage
    73
  • Abstract
    Solder technologies are being used for precision-aligned optoelectronic assemblies. Two representative configurations for such assemblies are shown in this paper. In the first the assembly´s component well is aligned to the substrate by the solder surface tension force. The second involves the use of mechanical stops that are pushed or pulled against each other by misaligned solder joints. The accuracies required for lateral alignments are in the range from 1 to 10 μm. Our research studies are aimed at engineering soldering techniques for precision alignments by developing 1) CAD tools for solder designs and 2) CAM tools to optimize and control solder and process parameters for a fluxless soldering process
  • Keywords
    soldering; 1 to 10 micron; CAD tools; CAM tools; fluxless soldering; mechanical stops; optoelectronic assemblies; solder self-alignment; surface tension force; Assembly; CADCAM; Computer aided manufacturing; Design automation; Fluid flow; Mechanical engineering; Process control; Soldering; Surface tension; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE
  • Conference_Location
    Boston, MA
  • Print_ISBN
    0-7803-1470-0
  • Type

    conf

  • DOI
    10.1109/LEOS.1994.586897
  • Filename
    586897