• DocumentCode
    3100570
  • Title

    High temperature immersion ultrasonic probes

  • Author

    Inoue, Takeru ; Iwata, Keiji ; Kobayashi, Masato

  • Author_Institution
    Grad. Sch. of Sci. & Technol., Kumamoto Univ., Kumamoto, Japan
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    469
  • Lastpage
    470
  • Abstract
    Ultrasonic probes without delay line, in order to improve SNR thermal shock resistance were developed. New immersion probe was composed by PZT/PZT sol-gel composite film onto thin metal plate with protection case. High temperature durability was achieved because sol-gel composite film had good acoustic coupling without couplant, had reasonable broadband characteristic without backing material, and the sol-gel composite film itself had high thermal shock resistance due to porosity in the film. That immersion probe could operate even at 200°C in silicone oil bath. Further it was possible to receive second reflected echoes from top and bottom surface of a 36 mm thick aluminum and it indicated that this probe showed possibility of non-destructive testing such as crack detection.
  • Keywords
    composite materials; durability; high-temperature effects; lead compounds; nondestructive testing; piezoelectric thin films; sol-gel processing; thermal resistance; thermal shock; PZT-PZT; SNR thermal shock resistance; acoustic coupling; backing materials; crack detection; high temperature durability; high temperature immersion ultrasonic probes; nondestructive testing; porosity; protection case; reflected echoes; silicone oil bath; sol-gel composite thin films; temperature 200 degC; thin metal plate; Acoustics; Aluminum; Delay lines; Films; Probes; Temperature measurement; Temperature sensors; high-temperature; immersion probe; nondestructive testing; sol-gel composite; ultrasonic transuducer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2013 IEEE International
  • Conference_Location
    Prague
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-5684-8
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2013.0121
  • Filename
    6725239