Packaging of optoelectronics and passive optics for intrasystem interconnects

Author

Grimes, G.J. ; Honea, W.K. ; Helton, J.S. ; Sherman, C.J. ; Sonnier, G.L.

Author_Institution

Alabama Univ., Birmingham, AL, USA

Volume

1

fYear

1994

fDate

31 Oct-3 Nov 1994

Firstpage

222

Abstract

Summary form only given. Optical backplanes can enhance the functionality of large system products at reasonable cost. In order to further exploit high technology, high fibre count multivendor multifiber array backplane connectors are needed. Intermateability at the backplane is a key goal. This should not preclude a wide variety of packaging approaches on both sides of the backplane. Standard multimode and single mode fibers should be supported, along with specialty fibers if desired. Two dimensional arrays with high fiber counts will be particularly useful. Backplane interconnection density is crucial and multifiber array connectors are powerful tools in this area

Keywords

integrated circuit packaging; backplane interconnection density; cost; high fiber counts; high fibre count multivendor multifiber array backplane connectors; high technology; intermateability; intrasystem interconnects; large system products; optical backplanes; optoelectronic packaging; packaging approaches; passive optics; single mode fibers; specialty fibers; standard multimode fibers; two dimensional arrays; Backplanes; Connectors; High speed optical techniques; Integrated circuit interconnections; Optical arrays; Optical fiber cables; Optical interconnections; Optical receivers; Optical transmitters; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE

Conference_Location

Boston, MA

Print_ISBN

0-7803-1470-0

Type

conf

DOI

10.1109/LEOS.1994.586973

Filename

586973