Multifibre electro-optical modules compatible with the fibre in board technology

Author

De Pestel, Geert ; Delbare, Wim ; Allaert, Koen ; Ambrosy, Anton ; Qingsheng, Tan ; Vandewege, Jan ; Verbeke, Jan ; Vrana, Miroslav

Author_Institution

Alcatel Bell Telephone, Antwerp, Belgium

Volume

1

fYear

1994

fDate

31 Oct-3 Nov 1994

Firstpage

224

Abstract

Summary form only given. The electro-optical board technology developed in the framework of the Race 2048 HIBITS program provides a full solution for chip-to-chip and board-to-board optical interconnections. In these electro-optical boards, precision alignment parts are embedded to bend the multi mode fibres towards the board surface. These surface optical taps provide alignment and interconnection facilities for electrooptical packages, a ribbon cable or a flexible optical back panel. In this paper we will discuss the different design approaches and realisations for a fibre in board compatible electro-optical package

Keywords

packaging; Race 2048 HIBITS program; alignment; board surface; board-to-board optical interconnections; chip-to-chip optical interconnection; design approaches; electro-optical board technology; electro-optical boards; electrooptical packages; fibre in board compatible electro-optical package; fibre in board technology; flexible optical back panel; interconnection facilities; multi mode fibre bending; multi mode fibres; multifibre electro-optical modules; precision alignment; ribbon cable; surface optical taps; Dielectric thin films; Electronic packaging thermal management; Integrated circuit interconnections; Optical arrays; Optical fiber cables; Optical interconnections; Optical receivers; Optical transmitters; Semiconductor laser arrays; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE

Conference_Location

Boston, MA

Print_ISBN

0-7803-1470-0

Type

conf

DOI

10.1109/LEOS.1994.586974

Filename

586974