DocumentCode
3102017
Title
Preliminary specification for a closed loop liquid cooling system product reliability test plan
Author
Stern, Margaret ; Copeland, David ; Vogel, Marlin ; Dunn, John ; Kearns, Don ; Lindquist, Steve
Author_Institution
Sun Microsyst., Santa Clara, CA
fYear
2009
fDate
15-19 March 2009
Firstpage
159
Lastpage
163
Abstract
Future high performance systems may incorporate liquid cooling to the board. These systems will be assembled using commercially available components and subsystems, which include the pump, liquid coolant, tubing and connections, heat exchanger, and cold plate. Liquid cooling systems are known to be susceptible to more degradation and failure mechanisms than conventional solid metal heatsinks, heat pipe heatsinks or vapor chamber heatsinks. Component and system providers need guidelines to ensure that their products meet projected reliability requirements. A generic preliminary specification has been assembled based on industry standards and information collected from leading equipment suppliers.
Keywords
cooling; refrigerants; reliability; thermal management (packaging); liquid cooling systems; product reliability test plan; refrigerant-based cooling; reliability specifications; water-based cooling; Assembly systems; Cold plates; Coolants; Degradation; Failure analysis; Heat pumps; Heat sinks; Liquid cooling; Solids; System testing; Liquid cooling; refrigerant-based cooling; reliability; reliability specifications; water-based cooling;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4244-3664-4
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2009.4810758
Filename
4810758
Link To Document