• DocumentCode
    3102017
  • Title

    Preliminary specification for a closed loop liquid cooling system product reliability test plan

  • Author

    Stern, Margaret ; Copeland, David ; Vogel, Marlin ; Dunn, John ; Kearns, Don ; Lindquist, Steve

  • Author_Institution
    Sun Microsyst., Santa Clara, CA
  • fYear
    2009
  • fDate
    15-19 March 2009
  • Firstpage
    159
  • Lastpage
    163
  • Abstract
    Future high performance systems may incorporate liquid cooling to the board. These systems will be assembled using commercially available components and subsystems, which include the pump, liquid coolant, tubing and connections, heat exchanger, and cold plate. Liquid cooling systems are known to be susceptible to more degradation and failure mechanisms than conventional solid metal heatsinks, heat pipe heatsinks or vapor chamber heatsinks. Component and system providers need guidelines to ensure that their products meet projected reliability requirements. A generic preliminary specification has been assembled based on industry standards and information collected from leading equipment suppliers.
  • Keywords
    cooling; refrigerants; reliability; thermal management (packaging); liquid cooling systems; product reliability test plan; refrigerant-based cooling; reliability specifications; water-based cooling; Assembly systems; Cold plates; Coolants; Degradation; Failure analysis; Heat pumps; Heat sinks; Liquid cooling; Solids; System testing; Liquid cooling; refrigerant-based cooling; reliability; reliability specifications; water-based cooling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-3664-4
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2009.4810758
  • Filename
    4810758