• DocumentCode
    3106979
  • Title

    A novel quick thermal test method and mechanism for coolers and thermal modules

  • Author

    Cheng, Yi-Hsiang ; Lin, Wei-Keng

  • Author_Institution
    Dept. of Eng. & Syst. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2004
  • fDate
    18-19 Nov. 2004
  • Firstpage
    87
  • Lastpage
    88
  • Abstract
    This paper describes a quick thermal test method and an innovative mechanism that have been developed for measuring the thermal resistance of coolers and thermal modules. The test method basically relies on accurate measurement of the differential temperature of coolers/thermal modules at each time step. A theoretical analysis was also carried out in order to predict the steady-state temperature even though the test time is limited. We have validated this novel test method on a variety of coolers/thermal modules and the results show quite reliable comparing to the convectional test method. We also show the figures of this quick thermal test mechanism and explain its market trend in the future.
  • Keywords
    differential thermal analysis; temperature measurement; convectional test method; cooler module; innovative mechanism; quick thermal test method; steady-state temperature; thermal module; thermal resistance measurement; Electrical resistance measurement; Space heating; Space technology; Steady-state; Temperature measurement; Testing; Thermal engineering; Thermal management of electronics; Thermal resistance; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics and Automation, 2004. TExCRA '04. First IEEE Technical Exhibition Based Conference on
  • Print_ISBN
    0-7803-8564-0
  • Type

    conf

  • DOI
    10.1109/TEXCRA.2004.1425012
  • Filename
    1425012