DocumentCode
3106979
Title
A novel quick thermal test method and mechanism for coolers and thermal modules
Author
Cheng, Yi-Hsiang ; Lin, Wei-Keng
Author_Institution
Dept. of Eng. & Syst. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2004
fDate
18-19 Nov. 2004
Firstpage
87
Lastpage
88
Abstract
This paper describes a quick thermal test method and an innovative mechanism that have been developed for measuring the thermal resistance of coolers and thermal modules. The test method basically relies on accurate measurement of the differential temperature of coolers/thermal modules at each time step. A theoretical analysis was also carried out in order to predict the steady-state temperature even though the test time is limited. We have validated this novel test method on a variety of coolers/thermal modules and the results show quite reliable comparing to the convectional test method. We also show the figures of this quick thermal test mechanism and explain its market trend in the future.
Keywords
differential thermal analysis; temperature measurement; convectional test method; cooler module; innovative mechanism; quick thermal test method; steady-state temperature; thermal module; thermal resistance measurement; Electrical resistance measurement; Space heating; Space technology; Steady-state; Temperature measurement; Testing; Thermal engineering; Thermal management of electronics; Thermal resistance; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation, 2004. TExCRA '04. First IEEE Technical Exhibition Based Conference on
Print_ISBN
0-7803-8564-0
Type
conf
DOI
10.1109/TEXCRA.2004.1425012
Filename
1425012
Link To Document