DocumentCode :
3107794
Title :
Accelerated testing and finite element analysis of PBGA under multiple environmental loadings
Author :
Qi, Haiyu ; Ganesan, Sanka ; Osterman, Michael ; Pecht, Michael
Author_Institution :
CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
fYear :
2004
fDate :
Apr 27-30, 2004
Firstpage :
99
Lastpage :
106
Abstract :
To investigate the long term reliability of plastic ball grid array (PBGA) packages in aerospace applications, accelerated tests were conducted to non-underfilled and underfilled packages under multiple environmental loadings at board level. This paper discusses the test results and the underfill effect on solder joint reliability. Failure modes and sites were identified through failure analysis on test samples. To better understand the thermomechanical behavior of PBGAs under cyclic thermal loading environments, three dimensional FEA models for non-underfilled and underfilled packages were also developed and used to predict the time to failure.
Keywords :
ball grid arrays; encapsulation; failure analysis; finite element analysis; integrated circuit packaging; integrated circuit reliability; life testing; plastic packaging; thermal stresses; 3D FEA; PBGA; accelerated testing; aerospace applications; board level multiple environmental loading; cyclic thermal loading; failure mode analysis; finite element analysis; long term reliability; nonunderfilled packages; plastic ball grid array packages; solder joint reliability; thermal cycling; thermomechanical behavior; time to failure; underfilled packages; Aerospace testing; Electronics packaging; Failure analysis; Field emitter arrays; Finite element methods; Life estimation; Plastic packaging; Soldering; Thermal loading; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Business of Electronic Product Reliability and Liability, 2004 International Conference on
Print_ISBN :
0-7803-8361-3
Type :
conf
DOI :
10.1109/BEPRL.2004.1308157
Filename :
1308157
Link To Document :
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