Title :
Effects of stress and cracks on the reliability of optoelectronic active components
Author_Institution :
Technol. Dept., Wuhan Res. Inst. of Posts & Telecommun., China
Abstract :
An experiment for evaluating stress effects on reliability of optoelectronic active components is developed. Here, we take the bi-directional devices as samples; two groups of devices are tested to Telcordia standards during temperature cycling. The power change of devices is associated with stress release. The output powers of the devices are monitored during the process and the power changes are recorded and analyzed. It shows that different samples have different power changes during the different temperature cycle times and the power changes present certain general trends. Further study shows that the large change of power is associated with the welding cracks.
Keywords :
cracks; optical fibre subscriber loops; optical receivers; optical transmitters; stress analysis; telecommunication equipment testing; telecommunication standards; thermal stresses; welding; FTTH; Telcordia standards; bi-directional device testing; crack effects; optoelectronic active components; output powers; power change trends; reliability; stress effects; stress release; temperature cycling; welding cracks; Assembly; Monitoring; Optical fiber devices; Optical fiber subscriber loops; Power generation; Residual stresses; Stability; Temperature; Testing; Welding;
Conference_Titel :
Business of Electronic Product Reliability and Liability, 2004 International Conference on
Print_ISBN :
0-7803-8361-3
DOI :
10.1109/BEPRL.2004.1308164
