Signal integrity analysis of single-ended and differential signaling in PCBs with EBG structure

Object of this paper is the signal integrity analysis of printed circuit boards with electromagnetic bandgap structures. In particular the signal quality of single-ended and DIFF lines is discussed both in time and frequency domain (S-parameters, TDR and eye-diagrams). Two different configurations (two dimensional and three dimensional) of electromagnetic bandgap structures are analyzed by means of a three dimensional full wave field simulator based on the finite integration technique. Results show a consistent improvement of the signal integrity when DIFF signaling is used, while keeping the typical advantage of noise mitigation due to electromagnetic bandgap layers.